features description/ordering information sn74auc2g06 dual inverter buffer/driver with open-drain outputs sces442c ? may 2003 ? revised january 2007 available in the texas instruments low power consumption, 10 m a at 1.8 v nanofree? package 8-ma output drive at 1.8 v optimized for 1.8-v operation and is 3.6-v i/o latch-up performance exceeds 100 ma per tolerant to support mixed-mode signal jesd 78, class ii operation esd protection exceeds jesd 22 i off supports partial-power-down mode ? 2000-v human-body model (a114-a) operation ? 200-v machine model (a115-a) sub-1-v operable ? 1000-v charged-device model (c101) max t pd of 2.5 ns at 1.8 v this dual inverter buffer/driver is operational at 0.8-v to 2.7-v v cc , but is designed specifically for 1.65-v to 1.95-v v cc operation. the output of the sn74auc2g06 device is open drain and can be connected to other open-drain outputs to implement active-low wired-or or active-high wired-and functions. the maximum sink current is 32 ma. nanofree? package technology is a major breakthrough in ic packaging concepts, using the die as the package. this device is fully specified for partial-power-down applications using i off . the i off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ordering information t a package (1) orderable part number top-side marking (2) nanofree? ? wcsp (dsbga) reel of 3000 SN74AUC2G06YZPR _ _ _ut_ 0.23-mm large bump ? yzp (pb-free) ?40 c to 85 c sot (sot-23) ? dbv reel of 3000 sn74auc2g06dbvr u06_ sot (sc-70) ? dck reel of 3000 sn74auc2g06dckr ut_ (1) package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. (2) dbv/dck: the actual top-side marking has one additional character that designates the assembly/test site. yzp: the actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. nanofree is a trademark of texas instruments. production data information is current as of publication date. copyright ? 2003?2007, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. www.ti.com see mechanical drawings for dimensions. dbv package (top view) dck package (top view) yzp package (bottom view) 2 gnd v cc 5 3 4 2a 2y 6 1 1a 1y 3 4 2a 2 gnd 2y 5 1 1a v cc 6 1y 2 gnd v cc 1 5 1a 2a 4 3 2y 6 1y
absolute maximum ratings (1) sn74auc2g06 dual inverter buffer/driver with open-drain outputs sces442c ? may 2003 ? revised january 2007 function table (each inverter) input output a y h l l h logic diagram (positive logic) over operating free-air temperature range (unless otherwise noted) min max unit v cc supply voltage range ?0.5 3.6 v v i input voltage range (2) ?0.5 3.6 v v o voltage range applied to any output in the high-impedance or power-off state (2) ?0.5 3.6 v v o output voltage range (2) ?0.5 v cc + 0.5 v i ik input clamp current v i < 0 ?50 ma i ok output clamp current v o < 0 ?50 ma i o continuous output current 20 ma continuous current through v cc or gnd 100 ma dbv package 165 q ja package thermal impedance (3) dck package 259 c/w yzp package 123 t stg storage temperature range ?65 150 c (1) stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) the input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. (3) the package thermal impedance is calculated in accordance with jesd 51-7. 2 submit documentation feedback www.ti.com 1a 1y 1 6 2a 2y 3 4
recommended operating conditions (1) electrical characteristics sn74auc2g06 dual inverter buffer/driver with open-drain outputs sces442c ? may 2003 ? revised january 2007 min max unit v cc supply voltage 0.8 2.7 v v cc = 0.8 v v cc v ih high-level input voltage v cc = 1.1 v to 1.95 v 0.65 v cc v v cc = 2.3 v to 2.7 v 1.7 v cc = 0.8 v 0 v il low-level input voltage v cc = 1.1 v to 1.95 v 0.35 v cc v v cc = 2.3 v to 2.7 v 0.7 v i input voltage 0 3.6 v v o output voltage 0 3.6 v v cc = 0.8 v 0.7 v cc = 1.1 v 3 i ol low-level output current v cc = 1.4 v 5 ma v cc = 1.65 v 8 v cc = 2.3 v 9 d t/ d v input transition rise or fall rate 20 ns/v t a operating free-air temperature ?40 85 c (1) all unused inputs of the device must be held at v cc or gnd to ensure proper device operation. refer to the ti application report, implications of slow or floating cmos inputs, literature number scba004. over recommended operating free-air temperature range (unless otherwise noted) parameter test conditions v cc min typ (1) max unit i ol = 100 m a 0.8 v to 2.7 v 0.2 i ol = 0.7 ma 0.8 v 0.25 i ol = 3 ma 1.1 v 0.3 v ol v i ol = 5 ma 1.4 v 0.4 i ol = 8 ma 1.65 v 0.45 i ol = 9 ma 2.3 v 0.6 i i a inputs v i = v cc or gnd 0 to 2.7 v 5 m a i off v i or v o = 2.7 v 0 10 m a i cc v i = v cc or gnd, i o = 0 0.8 v to 2.7 v 10 m a c i v i = v cc or gnd 2.5 v 2.5 pf (1) all typical values are at t a = 25 c. 3 submit documentation feedback www.ti.com
switching characteristics switching characteristics operating characteristics sn74auc2g06 dual inverter buffer/driver with open-drain outputs sces442c ? may 2003 ? revised january 2007 over recommended operating free-air temperature range, c l = 15 pf (unless otherwise noted) (see figure 1 ) v cc = 1.2 v v cc = 1.5 v v cc = 1.8 v v cc = 2.5 v v cc = 0.8 v from to 0.1 v 0.1 v 0.15 v 0.2 v parameter unit (input) (output) typ min max min max min typ max min max t plh 4.1 1.8 3.3 1.4 2.8 1.6 2.4 3 1.5 2.3 a y ns t phl 4.2 0.8 2.7 0.6 2 0.6 1 1.7 0.6 1.1 over recommended operating free-air temperature range, c l = 30 pf (unless otherwise noted) (see figure 1 ) v cc = 1.8 v v cc = 2.5 v from to 0.15 v 0.2 v parameter unit (input) (output) min typ max min max t plh 1.6 2 2.5 0.7 1.2 a y ns t phl 0.7 1.5 2.3 0.7 1.8 t a = 25 c v cc = 0.8 v v cc = 1.2 v v cc = 1.5 v v cc = 1.8 v v cc = 2.5 v test parameter unit conditions typ typ typ typ typ power dissipation c pd f = 10 mhz 2 2 2 2 3 pf capacitance 4 submit documentation feedback www.ti.com
parameter measurement information sn74auc2g06 dual inverter buffer/driver with open-drain outputs sces442c ? may 2003 ? revised january 2007 figure 1. load circuit and voltage waveforms 5 submit documentation feedback www.ti.com notes: a. c includes probe and jig capacitance. b. waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. c. all input pulses are supplied by generators having the following characteristics: prr 10 mhz, z = 50 , slew rate 1 v/ns. d. the outputs are measured one at a time, with one transition per measurement. e. t and t are the same as t . f. t and t are the same as t . g. t and t are the same as t . l o plz phz dis pzl pzh en plh phl pd w 3 from output under test c (see note a) l load circuit s1 2 v cc open gnd r l r l t /t plh phl open test s1 2 v cc t /t plz pzl gnd t /t phz pzh 0 v t w input 0 v input outputoutput voltage waveforms propagation delay times inverting and noninverting outputs voltage waveforms pulse duration v cc /2 v cc /2 v cc /2 v cc /2 v ol v oh v cc v cc v oh v ol v cc /2 v cc /2 v cc /2 v cc /2 t plh t phl t plh t phl t h t su data input timing input 0 v0 v output waveform 1 s1 at 2 v (see note b) cc output waveform 2 s1 at gnd (see note b) v ol v oh 0 v? 0 v output control v cc /2 v cc /2 v cc /2 v cc /2 v cc /2 voltage waveforms enable and disable times low- and high-level enabling voltage waveforms setup and hold times v cc v cc v cc v cc /2 v cc /2 v cc t pzl t plz t phz t pzh v C v oh d v + v ol d 0.8 v 1.2 v 0.1 v 1.5 v 0.1 v 1.8 v 0.15 v 2.5 v 0.2 v 1.8 v 0.15 v 2.5 v 0.2 v v cc 2 k w 2 k w 2 k w 2 k w 2 k w 1 k w 500 w r l 0.1 v0.1 v 0.1 v 0.15 v0.15 v 0.15 v 0.15 v v d c l 15 pf15 pf 15 pf 15 pf 15 pf 30 pf 30 pf
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) sn74auc2g06dbvr active sot-23 dbv 6 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74auc2g06dbvre4 active sot-23 dbv 6 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74auc2g06dbvrg4 active sot-23 dbv 6 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74auc2g06dckr active sc70 dck 6 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74auc2g06dckre4 active sc70 dck 6 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74auc2g06dckrg4 active sc70 dck 6 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74AUC2G06YZPR active wcsp yzp 6 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 29-may-2007 addendum-page 1
tape and reel information package materials information www.ti.com 19-may-2007 pack materials-page 1
device package pins site reel diameter (mm) reel width (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant sn74auc2g06dbvr dbv 6 hnt 180 9 3.23 3.17 1.37 4 8 q3 sn74auc2g06dckr dck 6 hnt 180 9 2.24 2.34 1.22 4 8 q3 SN74AUC2G06YZPR yzp 6 asek 180 8 1.02 1.52 0.66 4 8 q1 tape and reel box information device package pins site length (mm) width (mm) height (mm) sn74auc2g06dbvr dbv 6 hnt 202.0 201.0 28.0 sn74auc2g06dckr dck 6 hnt 202.0 201.0 28.0 SN74AUC2G06YZPR yzp 6 asek 220.0 220.0 34.0 package materials information www.ti.com 19-may-2007 pack materials-page 2
package materials information www.ti.com 19-may-2007 pack materials-page 3
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rfid www.ti-rfid.com telephony www.ti.com/telephony low power www.ti.com/lpw video & imaging www.ti.com/video wireless wireless www.ti.com/wireless mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2007, texas instruments incorporated
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